What's New
The article was published on Journal of Japan Institute of Electronics Packaging.
The article was published on Journal of Japan Institute of Electronics Packaging(Vol.27, No.2).
title: Smart Inspection Monitoring Using High-Speed Camera
author: Kohei Shimasaki, Feiyue Wang, Idaku Ishii
title: Smart Inspection Monitoring Using High-Speed Camera
author: Kohei Shimasaki, Feiyue Wang, Idaku Ishii